Stock for short:长盈通
Stock code:688143

CN OA
Composite Phase-change Cold Plate for Temperature Equilibrium
The heat flux density of electronic devices is often distributed unevenly, and the phase-change cold plate cannot effectively solve the problem by relying on the traditional heat transfer enhancement method. By integrating the design and manufacture of ultra-thin heat pipes, ultra-thin temperature equilibrium plates and other high-conductivity components with the phase-change cold plate, the heat can be evenly distributed across the entire cold plate, maximizing the utilization of phase-change materials, and significantly improving the temperature equilibrium of the cold plate under the condition of limited space and weight. The temperature gradient of single plate is within 5°C.
  • Integration of high thermal conductivity and temperature equilibrium components and phase-change
  • Integrated machining
  • Phase-change material with high enthalpy
  • Long temperature control time
  • High equivalent thermal conductivity
  • Automatic filling and low pressure sealing technology
  • Large heat storage
Hotline for consultation: +86-27-87981568
Product Characteristics
  • 01
    Integration of high thermal conductivity and temperature equilibrium components and phase-change
  • 02
    Integrated machining
  • 03
    Phase-change material with high enthalpy
  • 04
    Long temperature control time
  • 05
    High equivalent thermal conductivity
  • 06
    Automatic filling and low pressure sealing technology
  • 07
    Large heat storage
Specifications

Heat rate

Working time

Upper junction temperature limit of device

Environment temperature

Heat dissipation condition

Phase-change material

Latent heat of phase-change

150W 600s <90℃ 70℃

None

RK-80 270J/g